Polyimide tape is for high-temp exposures such as extended paint cures, baking between plating cycles, and masking PC boards. High chemical resistance.
Temp Rating: 500°F / 260°C
Recommended Processes: Powder Coating, E-Coating, Plating, Wave Soldering, Circuit Board Insulation
Total Thickness: 2.5 mil (1 mil film with 1.5 mil of silicone adhesive)
Application: Apply tape to clean surface and then apply pressure via a roller or squeegee to ensure tape creates an effective masking seal
Technical Data Sheet
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