Low-ESD Polyimide Tape
Low-ESD Polyimide Tape is made with anti-static adhesive to reduce the discharge of electroplating static upon tape removal. Commonly used for protecting gold finger of PCB during wave soldering process
Temp Rating: 500°F / 260°C
Recommended Processes: Plating, Wave Soldering, Circuit Board Insulation
Application: Apply tape to clean surface and then apply pressure via a roller or squeegee to ensure tape creates an effective masking seal
Technical Data Sheet
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